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BGA X Ray Inspection System

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MOQ : 1 Unit

BGA X Ray Inspection System Specification

Usage
Industrial

Function
BGA, PCB, and SMD solder joint inspection

Size
Available in diffrent size

Product Type
X Ray Inspection System

Operating Mode
Electronic

Control Mode
Automatic

Weight
5 Kilograms (kg)

Standard
Industrial Grade

Color
Blue and White

Stage Size
400mm x 400mm

Software Features
Image analysis, measurement, and report generation

Scanning Angle
360-degree rotatable platform

Image Resolution
Up to 2 megapixels

X-ray Tube Voltage
80kV 130kV adjustable

PC Interface
USB 3.0, LAN

X-ray Tube Current
0.1 1.0mA

Magnification
10x - 200x optical

Safety Features
Lead-shielded enclosure, safety interlocks

BGA X Ray Inspection System Trade Information

Minimum Order Quantity
1 Unit

Payment Terms
Cash Advance (CA)

Supply Ability
100 Units Per Month

Delivery Time
30 Days

Main Domestic Market
All India

About BGA X Ray Inspection System

Items		Contents
Model		X-6600
Japan Hamamatsu X-RAY launch tube	Tube type	Closed X-ray tube
Maximum tube voltage	90kV (130kV Optical)
Maximum tube current	0.12mA
Focal spot size	5m
Magnification	Geometric magnification: 150X System magnification: 1000X
Korea Rayence Flat Panel Detector	Image speed	30 fps
Resolution	1176*1104
Inclined Angle	60 deg dega
Cabinet Specifications	Table size	540mm*450mm
Dimension	Length: 1360mm, width: 1360mm, height: 1650mm
Net weight	1300kg
Input voltage	AC 110-220V (-/+10%) (international standard power supply)
X-ray leakage amount		1 u Sv/h
Operating system		Windows 7 Seamark3.0
Total power		1700W

Select the BGA X Ray Inspection System to capitalise on matchless precision and illustrious performance for your electronic testing needs. Engineered with an opulent 360-degree rotatable platform, this system accommodates components from micro-BGA to SMD. It boasts up to 2-megapixel image resolution, adjustable 80kV-130kV X-ray tube, and magnification from 10x to 200x optical. Automatic controls, USB 3.0/LAN connectivity, and advanced analysis software ensure seamless operation. Safety is paramount via lead-shielded enclosure and interlocks. Ideal for service providers, suppliers, and traders across India seeking high savings through efficiency, accuracy, and reliability.

Direction of Use and Practical Application

To utilise the BGA X Ray Inspection System, place your sample PCB or SMD assembly securely on the 400x400mm stage. The 360-degree rotatable platform combined with high-precision, micron-level accuracy ensures thorough inspection of solder joints. Designed for industrial application surfaces, it is ideal for in-depth analysis of micro-BGA, CSP, and QFN packages. As an automatic electronic usage type system, users can select optimal parameters for reliable defect detection.

Certifications, Sample Policy & Packaging Information

Our BGA X Ray Inspection System arrives after comprehensive industrial-grade certifications, ensuring consistent quality and safety standards. Samples can be provided upon request to demonstrate functionality prior to purchase. Systems are shipped in robust, secure packaging to guarantee safe arrival. We use trusted transport services to ensure timely delivery and complete protection until installation at your site. Each package includes all necessary documentation for rapid commissioning upon arrival.

FAQ's of BGA X Ray Inspection System:

Q: How does the 360-degree rotatable platform enhance inspection accuracy?

A: The 360-degree rotatable platform enables users to inspect components from all angles, ensuring comprehensive analysis and detection of hidden defects in solder joints.

Q: What types of components can the BGA X Ray Inspection System accommodate?

A: This inspection system suits a variety of components, including micro-BGA, CSP, QFN, and SMD, making it versatile for different industrial electronic assemblies.

Q: When should I use the image analysis and measurement software features?

A: Utilise these software functionalities during or after inspection sessions to analyse captured images, conduct precise measurements, and generate in-depth inspection reports.

Q: Where can the BGA X Ray Inspection System be installed?

A: The system is designed for industrial environments and can be installed at electronics manufacturing units, testing service providers, supplier labs, or trading facilities across India.

Q: What are the key safety measures of this inspection system?

A: Safety is ensured through a lead-shielded enclosure and built-in safety interlocks, allowing safe operation and limiting X-ray exposure to operators.

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